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ReturnCurrent location:Home / Products / Soldering machine / YAMAHA Soldering Machine
ConsultationTel:0755-23072448
Detailed introduction of equipment parameters:
Yamaha YS12F
Object substrate L50 × W50mm to L510 × W460mm;
Excellent mounting accuracy (μ+3 σ) ± 0.05mm/CHIP;
Installation efficiency of 20000CPH (our company's best condition);
Component supply;
Supply of rolls and trays;
Component types with tape packaging: 106 types (* large/converted to 8mm tape);
Disc packaging: 15 types (* large/converted to JEDEC pallets);
Object components 0402~45 × 100mm, including ball electrode components ※ □ 32mm or more, require the installation of specialized nozzle components;
Can be mounted at a height of 15mm;
Power specifications: three-phase AC 200/208/220/240/380/400/416 V ± 10%;
Gas supply source above 0.45MPa, in a clean and dry state;
Dimensions L1254 × W1755 × H1475mm (when assembling ATS15). Excluding protruding parts;
The main weight is about 1370kg (when assembling ATS15).


Business contact: 135 1023 8727 (Mr. Zhu)
Company official website: www.fuliudianzi.com