Welcome to the official website of Fu Liu Electronics Company. We will be more than happy to serve you.

ReturnCurrent location:Home / Products / Soldering machine / JUKI Soldering Machine
ConsultationTel:0755-23072448

The new modular placement machine RX-6 combines high productivity, versatility, and quality
Pick-and-Place Monitoring for RX-6 Features - Applicable to Electric Tape Feeders with Laser Recognition
■ Chip Components: 42,000 CPH (0.040 sec/chip, optimal conditions) 26,000 CPH: Chips (per IPC9850 standard)
■ IC Components: 14,000 CPH (MNVC)
■ 0402 (1005) chip to 33.5mm square components;
■ Laser recognition: ±0.04mm (±Cpk≥1);
■ Capable of mounting 160 types of components;
■ Space-saving design with a width of 1.25m;
■ Standard equipped with pick & place monitor inspection function for higher quality;
■ By changing the placement head, the optimal production line can be configured to adapt to variations in production models;
■ High-speed placement achieved through seamless image recognition;
■ Compatible with ultra-high components, large components, and large substrates;
Specifications/Model Name: High-speed modular placement machine RX-6 (6-nozzle placement head);
High-speed modular placement machine RX-6 (3-nozzle placement head);
Substrate size 50×50~610×590 / 905×590mm(2times clamping);
Component height 6mm specifications 6/12/20/25/33mm;
Component dimensions Laser recognition 0402 (imperial 01005) chip ~33.5mm square component;
Image recognition Standard camera □3~□33.5mm (MNVC) □3~100mm/50×180mm;
High-resolution camera (all optional accessories) 1005~□20mm (MNVC) 1005~□48mm/24×72mm;
Component placement speed (chip components) Optimal conditions 42,000 CPH 34,000 CPH IC;
※1 14,000CPH(MNVC) 11,000CPH(MNVC) Component placement accuracy ;
Laser recognition ±0.04mm (Cpk≥1) Image recognition ±0.03mm (MNVC±0.04mm)
Maximum component mounting types: Up to 160 types (converted to 8mm tape (when using electric dual-track tape feeders)) *1 The component mounting speed for IC components is an approximate value when mounting 36 points on an M-sized substrate. For square QFP components with dimensions under 10mm, the components are arranged front and back, and simultaneous pickup is performed using all nozzles.