Fuliu Electronic Intelligent Technology (Shenzhen) Co., Ltd

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Consultation Hotline136 3282 48680755-23072448

JUKI Soldering Machine
Service Hotline0755-23072448

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JUKI Chip Mounter RX-6 Series Category:JUKI Soldering Machine

Product Introduction:JUKI Placement Machine RX-7R: A Fully Upgraded High-Efficiency Chip Mounting Solution. 1. Outstanding Speed and Efficiency: 2. Precise Positioning and Mounting Accuracy: 3. Reliable Production and Quality Assurance: 4. Easy Operation and User-Friendly:

ConsultationTel:0755-23072448

Product Introduction

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The new modular placement machine RX-6 combines high productivity, versatility, and quality

Pick-and-Place Monitoring for RX-6 Features - Applicable to Electric Tape Feeders with Laser Recognition


■ Chip Components: 42,000 CPH (0.040 sec/chip, optimal conditions) 26,000 CPH: Chips (per IPC9850 standard)

■ IC Components: 14,000 CPH (MNVC)

■ 0402 (1005) chip to 33.5mm square components;

■ Laser recognition: ±0.04mm (±Cpk≥1);

■ Capable of mounting 160 types of components;

■ Space-saving design with a width of 1.25m;

■ Standard equipped with pick & place monitor inspection function for higher quality;

■ By changing the placement head, the optimal production line can be configured to adapt to variations in production models;

■ High-speed placement achieved through seamless image recognition;

■ Compatible with ultra-high components, large components, and large substrates;

Specifications/Model Name: High-speed modular placement machine RX-6 (6-nozzle placement head);

High-speed modular placement machine RX-6 (3-nozzle placement head);

Substrate size 50×50~610×590 / 905×590mm(2times clamping); 

Component height 6mm specifications 6/12/20/25/33mm;

Component dimensions Laser recognition 0402 (imperial 01005) chip ~33.5mm square component;

Image recognition Standard camera □3~□33.5mm (MNVC) □3~100mm/50×180mm;

High-resolution camera (all optional accessories) 1005~□20mm (MNVC) 1005~□48mm/24×72mm;

Component placement speed (chip components) Optimal conditions 42,000 CPH 34,000 CPH IC;

※1 14,000CPH(MNVC) 11,000CPH(MNVC) Component placement accuracy ;

Laser recognition ±0.04mm (Cpk≥1) Image recognition ±0.03mm (MNVC±0.04mm)

Maximum component mounting types: Up to 160 types (converted to 8mm tape (when using electric dual-track tape feeders)) *1 The component mounting speed for IC components is an approximate value when mounting 36 points on an M-sized substrate. For square QFP components with dimensions under 10mm, the components are arranged front and back, and simultaneous pickup is performed using all nozzles.