Product Features:

1. High-volume semiconductor packaging chip precision online cleaning system.

2. Spray cleaning method, effectively removes flux and organic/inorganic contaminants.

3. Sequential process: chemical cleaning + DI water rinsing + hot air drying.

4. Automatic cleaning solution replenishment; automatic DI water replenishment.

5. The spray pressure of the cleaning solution is adjustable to meet different cleaning requirements.

6. High flow rate and pressure ensure complete penetration of cleaning solution and DI water into micro-gaps of components, achieving thorough cleaning.

7. Equipped with a rinse resistivity monitoring system to detect the quality of DI rinse water.

8. Air knife wind shear + extended infrared hot air circulation drying system.

9. PLC control system with Chinese/English operation interface, allowing easy program setup, modification, storage, and retrieval.

10. SUS304 stainless steel body, pipes, and components, resistant to temperature, acidic, alkaline cleaning solutions, etc.

11. Can be connected with front and rear equipment to form an automated cleaning line.

12. Optional configurations including cleaning solution concentration monitoring and more.